PRINTED CURCUIT BOARD
Inquire NowPRINTED CURCUIT BOARD
| TECHNICAL CAPABILITY: | |
| LAYER NUMBER(PCB) | PRODUCTION: 2-8 LAYERS/SAMPLE: 16 LAYERS |
| MAXIMUM PLATE THICKNESS | PRODUCTION: 10MM/SAMPLE: 10MM |
| MATERIAL SCIENCE | FR-4 (ORDINARY FR4, MEDIUM TG FR4, HIGH TG FR4, LEAD-FREE WELDED PLATE), HALOGEN-FREE PLATE, CERAMIC FILLER, PTFE, PI, BT, PPO, PPE, MIXING, LOCAL MIXING, ETC. |
| MINIMUM LINEWIDTH/SPACING | INNER 3MIL/3MIL(HOZ) AND OUTER 4MIL/4MIL(HOZ+PLATING) |
| MAXIMUM COPPER THICKNESS | PRODUCTION: 3.0 OZ (UL) / SAMPLE: 12 OZ (SAMPLE) |
| MINIMUM APERTURE | MECHANICAL DRILLING8 mil (0.20mm) / MECHANICAL DRILLING3 mil (0.075mm) |
| MAXIMUM SIZE (FINISHED PRODUCT) | 1230mm X 550mm |
| MAXIMUM THICKNESS-DIAMETER RATIO | 18:01 |
| SURFACE TREATMENT | HASL、ENIG、CHEMICALTIN、CHEMICAL SILVER、OSP、GOLD-PLATED FINGER、ENIG+OSP、CHEMISTRY NiPdAu |
| SPECIAL PROCESSING | BURIED HOLE、BLIND VIA、STEP GROOVE、METAL BASE、EMBEDDED RESISTANCE、EMBEDDED CAPACITOR、MIXED PRESSURE、LOCAL MIXING、LOCAL HIGH DENSITY、BACK DRILLING、IMPEDANCE CONTROL, ETC. |